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| ACTS244MS January 1996 Radiation Hardened Octal Non-Inverting Three-State Buffer Pinouts 20 PIN CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR CDIP2-T20, LEAD FINISH C TOP VIEW AE 1 2 3 4 5 6 7 8 9 20 VCC 19 BE 18 AO1 17 BI4 16 AO2 15 BI3 14 AO3 13 BI2 12 AO4 11 BI1 Features * Devices QML Qualified in Accordance with MIL-PRF-38535 * Detailed Electrical and Screening Requirements are Contained in SMD# 5962-96718 and Intersil's QM Plan * 1.25 Micron Radiation Hardened SOS CMOS * Total Dose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >300K RAD (Si) * Single Event Upset (SEU) Immunity: <1 x 10 (Typ) -10 AI1 BO4 AI2 BO3 AI3 BO2 AI4 BO1 Errors/Bit/Day * SEU LET Threshold . . . . . . . . . . . . . . . . . . . . . . . >100 MEV-cm2/mg * Dose Rate Upset . . . . . . . . . . . . . . . . >1011 RAD (Si)/s, 20ns Pulse * Dose Rate Survivability . . . . . . . . . . . >1012 RAD (Si)/s, 20ns Pulse * Latch-Up Free Under Any Conditions * Military Temperature Range . . . . . . . . . . . . . . . . . . -55oC to +125oC * Significant Power Reduction Compared to ALSTTL Logic * DC Operating Voltage Range . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V * Input Logic Levels - VIL = 0.8V Max - VIH = VCC/2 Min * Input Current 1A at VOL, VOH * Fast Propagation Delay . . . . . . . . . . . . . . . 14.5ns (Max), 10ns (Typ) GND 10 20 PIN CERAMIC FLATPACK MIL-STD-1835 DESIGNATOR CDFP4-F20, LEAD FINISH C TOP VIEW AE AI1 BO4 AI2 BO3 AI3 BO2 AI4 BO1 GND 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCC BE AO1 BI4 AO2 BI3 AO3 BI2 AO4 BI1 Description The Intersil ACTS244MS is a Radiation Hardened Octal Non-Inverting Three-State Buffer having two active low enable inputs. The ACTS244MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of radiation hardened, high-speed, CMOS/SOS Logic Family. The ACTS244MS is supplied in a 20 lead Ceramic Flatpack (K suffix) or a Dual-In-Line Ceramic Package (D suffix). Ordering Information PART NUMBER 5962F9671801VRC 5962F9671801VXC ACTS244D/Sample ACTS244K/Sample ACTS244HMSR TEMPERATURE RANGE -55oC to +125oC -55oC to +125oC 25oC 25oC 25oC SCREENING LEVEL MIL-PRF-38535 Class V MIL-PRF-38535 Class V Sample Sample Die PACKAGE 20 Lead SBDIP 20 Lead Ceramic Flatpack 20 Lead SBDIP 20 Lead Ceramic Flatpack Die CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999 Spec Number File Number 1 518784 3187.1 ACTS244MS Functional Diagram NOTE: (1 CIRCUIT OF 2) AE 1(19) AI1 2(11) P AO1 N 18(9) P AI2 4(13) AO2 N 16(7) P AI3 6(15) AO3 N 14(5) P AI4 8(17) AO4 N 12(3) TRUTH TABLE INPUTS AE, BE L L H AIn, BIn L H X OUTPUT AOn, BOn L H Z NOTE: H = High Voltage Level, L = Low Voltage Level, X = Immaterial, Z = High Impedance Spec Number 2 518784 ACTS244MS Die Characteristics DIE DIMENSIONS: 100 x 100 (mils) 2.54 x 2.54 (mm) METALLIZATION: Type: AlSi Metal 1 Thickness: 7.125kA 1.125kA Metal 2 Thickness: 9kA 1kA GLASSIVATION: Type: SiO2 Thickness: 8kA 1kA WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 110 x 110 (m) 4.4 x 4.4 (mils) Metallization Mask Layout ACTS244MS AI1 (2) AE (1) VCC (20) VCC (20) BE (19) (18) AO1 BO4 (3) (17) BI4 AI2 (4) (16) AO2 BO3 (5) (15) BI3 AI3 (6) (14) AO3 BO2 (7) (13) BI2 AI4 (8) BO1 (9) AO4 (12) (10) (10) GND GND (11) BI1 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com Spec Number 3 518784 |
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